Тип публикации: статья из журнала
Год издания: 2020
Ключевые слова: boron doping, complex system, jewelry, noble metal alloy, palladium, solder
Аннотация: The aim of this work is to develop a new solder with a lower melting temperature, relative to standard palladiumbased alloys, and improved technological properties using a three-component system additionally doped with boron. As a theoretical basis used approach to the analysis of complex systems developed by Professor Biront V.S. An experimental testing of boron was carried out at a content of 2.2 to 3.1 Wt% as a eutectic-forming substance in solder alloys of palladium. The methodology and technological modes of obtaining a new palladium-based solder alloy with a melting point of 1200 °C are also presented. Tests of the new alloy performed in the conditions of jewellery production gave positive results, on the basis of which its final composition was determined. This methodology was applied in the development of new compositions for noble metal alloys, which are protected by Russian and Eurasian patents. ©2006-2020 Asian Research Publishing Network (ARPN).
Журнал: ARPN Journal of Engineering and Applied Sciences
Выпуск журнала: Vol. 15, Is. 12
Номера страниц: 1393-1397
ISSN журнала: 18196608
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